JPH0343346B2 - - Google Patents

Info

Publication number
JPH0343346B2
JPH0343346B2 JP60039951A JP3995185A JPH0343346B2 JP H0343346 B2 JPH0343346 B2 JP H0343346B2 JP 60039951 A JP60039951 A JP 60039951A JP 3995185 A JP3995185 A JP 3995185A JP H0343346 B2 JPH0343346 B2 JP H0343346B2
Authority
JP
Japan
Prior art keywords
plating
concentration
amount
information
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60039951A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61199069A (ja
Inventor
Yutaka Sugiura
Shigeo Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP60039951A priority Critical patent/JPS61199069A/ja
Publication of JPS61199069A publication Critical patent/JPS61199069A/ja
Priority to US07/406,863 priority patent/US5182131A/en
Publication of JPH0343346B2 publication Critical patent/JPH0343346B2/ja
Priority to US07/842,507 priority patent/US5200047A/en
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Automation & Control Theory (AREA)
  • Chemically Coating (AREA)
JP60039951A 1985-02-28 1985-02-28 めっき液濃度自動連続管理装置 Granted JPS61199069A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP60039951A JPS61199069A (ja) 1985-02-28 1985-02-28 めっき液濃度自動連続管理装置
US07/406,863 US5182131A (en) 1985-02-28 1989-09-13 Plating solution automatic control
US07/842,507 US5200047A (en) 1985-02-28 1992-02-27 Plating solution automatic control

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60039951A JPS61199069A (ja) 1985-02-28 1985-02-28 めっき液濃度自動連続管理装置

Publications (2)

Publication Number Publication Date
JPS61199069A JPS61199069A (ja) 1986-09-03
JPH0343346B2 true JPH0343346B2 (en]) 1991-07-02

Family

ID=12567269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60039951A Granted JPS61199069A (ja) 1985-02-28 1985-02-28 めっき液濃度自動連続管理装置

Country Status (2)

Country Link
US (1) US5182131A (en])
JP (1) JPS61199069A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012176626A1 (ja) * 2011-06-24 2012-12-27 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03291384A (ja) * 1990-04-06 1991-12-20 Hitachi Chem Co Ltd 無電解めっき方法及び装置
DE4391640T1 (de) * 1992-04-17 1994-05-05 Nippon Denso Co Verfahren und Gerät zum Detektieren einer Konzentration einer chemischen Behandlungslösung und automatisches Steuergerät dafür
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters
US5631845A (en) * 1995-10-10 1997-05-20 Ford Motor Company Method and system for controlling phosphate bath constituents
KR100201377B1 (ko) * 1995-10-27 1999-06-15 김무 다성분 도금용액의 농도조절장치
US5993892A (en) * 1996-09-12 1999-11-30 Wasserman; Arthur Method of monitoring and controlling electroless plating in real time
US7147827B1 (en) * 1998-05-01 2006-12-12 Applied Materials, Inc. Chemical mixing, replenishment, and waste management system
WO2000003073A2 (en) * 1998-07-13 2000-01-20 Dj Parker Company, Inc. D/B/A Parker Systems Paced chemical replenishment system
JP2001020077A (ja) * 1999-07-07 2001-01-23 Sony Corp 無電解めっき方法及び無電解めっき液
US6521112B1 (en) * 1999-07-13 2003-02-18 Dj Parker Company, Inc. Paced chemical replenishment system
US6974951B1 (en) 2001-01-29 2005-12-13 Metara, Inc. Automated in-process ratio mass spectrometry
US6524642B1 (en) 2001-04-21 2003-02-25 Omg Fidelity, Inc. Electroless metal-plating process
US7220383B2 (en) 2001-07-13 2007-05-22 Metara, Inc. Method and instrument for automated analysis of fluid-based processing systems
US7531134B1 (en) 2002-03-08 2009-05-12 Metara, Inc. Method and apparatus for automated analysis and characterization of chemical constituents of process solutions
US6773760B1 (en) * 2003-04-28 2004-08-10 Yuh Sung Method for metallizing surfaces of substrates
US7851222B2 (en) * 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
CN102471918B (zh) * 2009-07-16 2015-05-27 朗姆研究公司 无电沉积溶液和工艺控制
CN109143421B (zh) * 2018-06-27 2022-09-27 深圳市锦瑞新材料股份有限公司 一种退镀工艺
CN119553345A (zh) * 2025-01-27 2025-03-04 江苏台祥自动化科技有限公司 一种电镀药剂的自适应添加装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926660B2 (ja) * 1979-03-07 1984-06-29 株式会社東芝 無電解メツキ反応の測定方法
DE2911073C2 (de) * 1979-03-21 1984-01-12 Siemens AG, 1000 Berlin und 8000 München Verfahren und Vorrichtung zum automatischen Messen und Regeln der Konzentration der Hauptkomponenten eines Bades zum stromlosen Abscheiden von Kupfer
US4406249A (en) * 1979-11-14 1983-09-27 C. Uyemura & Co., Ltd. Apparatus for controlling electroless plating bath
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
US4556845A (en) * 1982-05-17 1985-12-03 International Business Machines Corporation Method for monitoring deposition rate using an eddy current detector
JPS602386A (ja) * 1983-06-20 1985-01-08 Rohm Co Ltd 熱印字ヘツド
US4479980A (en) * 1983-12-16 1984-10-30 International Business Machines Corporation Plating rate monitor
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012176626A1 (ja) * 2011-06-24 2012-12-27 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体
JP2013007099A (ja) * 2011-06-24 2013-01-10 Tokyo Electron Ltd めっき処理装置、めっき処理方法および記憶媒体

Also Published As

Publication number Publication date
JPS61199069A (ja) 1986-09-03
US5182131A (en) 1993-01-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees